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Device type
Processor
Memory
Sensors
Wireless
RF
Power management
Others
Manufacturer
Qualcomm
MTK
Apple
Samsung
Micron
SKhynix
Qorvo
TI
NXP
TOSHIBA
Sony
RFMD
Analysis type
BIR (Basic Information Report)
BPA (Brief Process Analysis)
HDO (High Definition Outlines)
HDI (High Definition Images)
DFR (Device Floorplan Report)
PAR (Process Analysis Report)
CAR (Circuit Analysis Report)
Release date
2021
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